Melting point 211 - 223 °C
Alloy composition: Sn96.4 / Ag1.1 / Cu0.7 / Bi1.8 / +Ni
Particle thickness: 20-38 microns (Type 4)
Flux content: 11.2% No-Clean
HF Halogen free, ROL0,
Stickiness: >24h
Lead-free solder paste, 500g package

Features:

• Highly reliable alloy, resists thermal stress better than SAC 305

• Same temperature profile as SAC 305 pastes - easy swap

• Flux residues are non-sticky and suitable for ICT testers.

• The flux meets the requirement of Halogen Free (Cl+Br+F=0 ppm) according to BS EN14582