Higher melting point 217 - 227 ° C
Alloy composition: Sn99.2 / Ag0.1 / Cu0.7 / Co0.03
Particle thickness: 20-45 microns (Type 3)
Flux content: 11.1% No-Clean
Halide-free, ROL0,
Stickiness:> 48h
Lead-free solder pastes, package 500g

Features:

• Highly reliable alloy

• Not suitable for Vapour Phase Ovens with 230 ° C condensing medium.

• The recommended remelting temperature is 240 - 260 ° C - see the profile in the gallery.