Bigger Batch Reflow Oven HR-23LF. Designed for leadfree soldering !

HR-23LF is batch type oven designed for leadfree soldering in preference. Partly shielded heaters result to rectangular
heat distribution and muting negatives of heating in visible range of spectum. Axial fan with dark heating spiral situated in
backside warant hot air moving under component as well as into so called heat shadows. So there is reached relative
small temperature difference between components and it is perfect suitable for leadfree soldering.
The advantage of one cell batch type reflow oven is possibility of settings special profile for each PCB and maximum
soldering time is almost unlimited.

Oven HR-23LF is designed as autonomous device. PCB prepared for soldering is inserted on door rack and by pressing
button situated on front panel is executed door closing and after that is executed soldering process. After finishig this
process will door open and is applied forced PCB and oven cooling.
Inserting of solder programs is very easy by common PC keyboard which you can connect to oven. On front panel are two
LCD displays for checking oven state and temperature. After connecting termocouple is possible to measure temperature
diagram right on PCB.
For precision temperature tracking and recording up to 8 channels we recommend to use Datalogger MTP-05.
Designed for leadfree soldering !

Technical Data:
Power source 3 phases, 3 x 400 V, 50 Hz
Max. dimensions: 4800 W (3x16A circuit breaker B)
Heating elements: 12x Philips 230V Large (189mm), 2000h, 1000W R7S 230V, 2900k
Dimensions: 750x570x450 mm
Max weight: 37 kg
Time: 1-999 sek.
Temperature: 50-260 °C
Grid dimensions: 410x500 mm
Max dimensions of PCB: 400x470 mm