Composition: Sn96,5 Ag3 Cu0,5
Size of elements: 20-38 micron, Melting point: 217 - 219ºC
Package: 500 gram jar

Flux content: 11,5%
Halide free. ROL0
Tack time: >48h
Shelf life (below 10°C): 6 months

Solder alloy composition is Sn 3.0Ag 0.5Cu (SAC305)
EXCELLENT WETTING to severely oxidized patterns or components,
such as oxidized Cu substrate, oxidized Sn and NiPd plating.
PERFECT MELTING and wetting at super fine pitch (>0.4mm pitch) and
micro components (>0.25mm dia CSP, 0603 chip).
Specially formulated flux chemistry ensures EXTREMELY LOW VOIDING with
CSPs and broad contact area components, e.g. QFN.
Designed to prevent occurrence of HIDDEN PILLOW DEFECTS.
Enables REUSE of leftover from previous day. Economical.