Powerful fine lead-free paste approved for use in Mycronic JET dispensers. Filled in QuantX 30 ml cartridges.
Composition: Sn96.5 / Ag3.0 / Cu0.5, SAC 305
Melting point: 217 - 219ºC
Grit: 10-25 microns, Type 5
Flux content: 15%, Halogen-free ROL0 according to IPC J-STD-004A
Packaging: cartridge 30 ml, 100 g
Stickiness: > 48h
Lead-free, halogen-free solder paste for dispenser, package 100g, 30 ml

Features

- Uniformly spherical solder powder
When using ordinary fine solder paste, graininess of the surface often appears after reflow. This is due to the fact that, in addition to particles whose size is defined by the grain type, it also contains a number of miniature particles below 1 micron and these are prone to surface oxidation. The powder oxidized in this way does not melt during the reflow process, but remains stuck to the surface of the joint and contributes to further oxidation.
The paste S3X70-E160DN contains only selected sizes and shapes of solder balls, and thus the perfect melting of all particles and a smooth non-oxidized surface are preserved.

- Continuously the same form of deposit
Carefully selected solder particles and flux with a stable viscosity guarantee the same shape and size of the applied dot even with large repetitions of doses. The picture shows a comparison of the applied dots with a diameter of 300 microns at the beginning and after 3000 doses from the same cartridge.

- Excellent high-speed JET dosing performance
With optimized solder powder size and viscosity and thixotropy treatment, S3X70-E160DN eliminates the problems of conventional jet dispensing solder paste such as needle clogging.
Furthermore, it prevents the formation of icicles and spattering even during high-speed nozzle dosing.