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Halogen free fine solder paste for stencil printing.
Low grit ideal for use on size 0201 chips.
Composition: Sn Ag3.0 Cu0.5 - SAC 305
Melting point: 217 - 219ºC
Particle size: 10-25 microns (Type 5)
Flux content: 11.5% ROL0, No-Clean
Halogen Free: ROL0 according to IPC J-STD-004A
Stickiness: >48h
Lead-free solder paste, 500g package