Lead-free, halogen-free stencil printing paste.
Flux residues are non-sticky, do not stain test needles and can be cleaned
Composition: Sn Ag3.0 Cu0.5 - SAC 305
Melting point: 217 - 219ºC

Particle thickness: 20-38 microns (Type 4)
Flux content: 11.5% ROL0, No-Clean - flux residues are safe and can remain on the PCB. If necessary, they can be cleaned.
Halogen Free: (F+Cl+Br+I < 500 ppm) ROL0 according to IPC J-STD-004B
Stickiness: >24h
Lead-free solder paste, 500g package