Composition: Sn96.5 / Ag3 / Cu0.5
Particle thickness: 20-38 microns, Melting point: 217 - 219 ° C
Packaging: 0.5 kg can. Improved features over the S3X58-M500C-5.

Flux content: 11.8%
Halide-free, ROL0
Stickiness:> 72h
Lead-free halide-free solder pastes, package 500g

Solder alloy composition Sn96,5 Ag3 Cu0,5 (SAC305)
Excellent wetting of oxidized surfaces.
Perfect melting and wetting for a very fine grid (> 0.4 mm).
S3X58-M500C-5 shows much higher tack and remelting of even the finest structures