- My AccountDon't have an account yet? Sign up now!
- 00,00 €
You are using an unsupported browser - the site is running in restricted mode. For proper operation of the site, use, for example, mozilla Firefox, google Chrome, MS Edge and the like.
You are using an unsupported browser - the site is running in restricted mode. For proper operation of the site, use, for example, mozilla Firefox, google Chrome, MS Edge and the like.
S3X58-HF1100, by adopting newly developed techniques through our expertise and experiences, has gained excellent results
in all soldering features such as wetting, flux splattering, voiding, printing, tackiness, electrical reliability, halogen free, etc.
S3X58-HF1100 has applied a newly engineered flux technology in which solder particles are protected from being oxidized
by an easy-to-remove protective layer and the antioxidant in the flux suppresses continued oxidation over time.
Such effects help save the amount of activator needed for oxidation prevention, as well as the activator capping technique which allows maximum activation strength when the solder is molten.
The flux formulation of S3X58-HF1100 solder paste is specifically designed to exhibit enhanced flux coagulation
at the time when the solder starts to melt.Instant coagulation and evacuation of the liquified flux when the solder gets molten,
brings about various benefits in soldering performance such as reduction in voiding rate and flux splattering, and improved wetting.
Newly designed flux coagulation technique enables consistently
low voiding achieved with each component type and surface finish.
Product Name S3X58-HF1100 / S3X70-HF1100
Product Category Solder Paste
Composition Sn 3.0Ag 0.5Cu
Melting Point(℃) 217 - 219
Particle Size(μm)20 - 38 / 10 - 25 (Type 4 / Type 5 )
Viscosity(Pa.s)190 ± 30
Flux Content(%) 11.7 ± 1.0 / 12.0 ± 1.0
Halide content(%) 0
Flux Type ROL0(IPC J-STD-004B and 004C)
s3x58-hf1100-nov2021.pdf (237.46 KB) |