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Halogen free paste for automotive

Halogen free paste for automotive

Code S3X58-HF1100
Availability On order

A Solution to Just About All Soldering Requirements

S3X58-HF1100, by adopting newly developed techniques through our expertise and experiences, has gained excellent results
in all soldering features such as wetting, flux splattering, voiding, printing, tackiness, electrical reliability, halogen free, etc.

Powerful Wetting Technique Advances Solder Joint Reliability

S3X58-HF1100 has applied a newly engineered flux technology in which solder particles are protected from being oxidized
by an easy-to-remove protective layer and the antioxidant in the flux suppresses continued oxidation over time.
Such effects help save the amount of activator needed for oxidation prevention, as well as the activator capping technique which allows maximum activation strength when the solder is molten.

Flux Coagulation Technique Improves First Pass Yield

The flux formulation of S3X58-HF1100 solder paste is specifically designed to exhibit enhanced flux coagulation
at the time when the solder starts to melt.Instant coagulation and evacuation of the liquified flux when the solder gets molten,
brings about various benefits in soldering performance such as reduction in voiding rate and flux splattering, and improved wetting.

Low Voiding

Newly designed flux coagulation technique enables consistently
low voiding achieved with each component type and surface finish.

 

Technical specification

Product Name          S3X58-HF1100 / S3X70-HF1100

Product Category    Solder Paste

Composition           Sn 3.0Ag 0.5Cu

Melting Point(℃)    217 - 219

Particle Size(μm)20 - 38 / 10 - 25 (Type 4 / Type 5 )

Viscosity(Pa.s)190 ± 30

Flux Content(%)    11.7 ± 1.0 / 12.0 ± 1.0

Halide content(%)  0

Flux Type            ROL0(IPC J-STD-004B and 004C)

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